MediaTek Dimensity 8250 was Introduced with 5G Connectivity and Artificial Intelligence Capabilities
In the luxury mid-range market, MediaTek has introduced the Dimensity 8250, a new chipset. Based on TSMC’s ultra-efficient 4nm architecture, it is a 5G…
Qualcomm Debuts Snapdragon 8s Gen 3: Boasts On-Device Generative AI and 200-Megapixel Camera Support
The latest flagship-grade chipset from Qualcomm, the Snapdragon 8s Gen 3, was unveiled on Monday and comes with a number of on-device artificial intelligence…
Satellite Connectivity Direct to Your Smartphone: Starlink’s New Frontier
The first satellites from Starlink with a direct smartphone connection capability. This marks the beginning of a new era in global connectivity rather than…