The mid-range smartphones that will run on the MediaTek Dimensity 7300 and Dimensity 7300X chipsets have been introduced by MediaTek. The freshly unveiled chipsets, according to the business, offer best-in-class efficiency and outstanding performance since they are produced utilizing a very efficient 4nm technology.
Features and Specifications of MediaTek Dimensity 7300 and Dimensity 7300X SoCs
The most recent chipset in the Dimensity 7300 series has eight cores and a maximum clock speed of 2.5 GHz. It is equipped with an ARM Mali G615 MC2 GPU, four Cortex A78 cores operating at 2.5GHz, and four Cortex A55 cores operating at 2.0GHz. The MediaTek Dimensity 7300X SoC’s ability to support two displays is the main distinction between the two chipsets.
MediaTek also adds the MediaTek 6th generation APU 655 to the recently revealed chipsets. Compared to previous chipsets, the new ones are said to provide twice as good AI processing. Along with improved connection, the Dimensity 7300 and Dimensity 7300X sport Bluetooth 5.4 and Wi-Fi 6E.
By optimizing MediaTek HyperEngine and upgrading the GPU, MediaTek also improves gaming performance. Compared to rival chipsets, this one offers 20% more FPS while using 20% less energy. Check out the freshly released MediaTek SoCs’ technical specifications.
CPU: 4 x 2.5GHz Cortex A78, 4 x 2.0GHz Cortex A55.
GPU: Mali G615 MC2 Arm armi.
Memory: UFS 3.1, LPDDR4x, LPDDR5, Up to 6400Mbps.
Camera: MediaTek Imagiq 950 ISP, Max 200MP sensor, 4K 30fps (3840 x 2160) video recording, hardware face detection, hardware multi-channel noise reduction, 4K HDR, video edge information stitching, all-pixel autofocus, dual simultaneous video recording, AI-3A with AE, AWB, and AF.
Display: Dual 7300X-only MediaTek MiraVision 955 Full HD+ (144Hz refresh rate) and WFHD+ (120Hz refresh rate) displays.
AI: MediaTek APU 655, sixth generation.
Connectivity: 2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), Bluetooth 5.4, Wi-Fi 6E, GPS, BeiDou, Glonass, Galileo, QZSS, NavIC.
Future Smartphones will be Powered by MediaTek Dimensity 7300 and Dimensity 7300X SoCs
It is anticipated that Motorola would integrate the Dimensity 7300X 5G into the Motorola Razr 50 clamshell folding smartphone. The smartphone, which scored 1033 points in single-core tests and 2751 points in multi-core tests, was recently noticed on Geekbench. The OPPO Reno 12 5G global variant, which will come with the standard Dimensity 7300 SoC, is also anticipated to make its debut.